The CMP process involves a specialized machine with a rotating platen covered with a polishing pad designed to interact effectively with the slurry and specimen surface. A chemical slurry containing fine abrasive particles is dispensed onto the polishing pad. The specimen is pressed against the pad with controlled downward force, while both the pad and the specimen rotate, ensuring uniform material removal and a highly polished finish
Metallographic sample preparation plays a fundamental role in ensuring material integrity, helping engineers and quality control professionals assess microstructures, detect defects, and verify compliance with stringent industry standards.
Polishing is a critical step in metallographic sample preparation, ensuring specimens are free from scratches, deformations, and surface damage, all of which are essential for accurate analysis. Obtaining a flawless surface requires precision abrasives like diamond, aluminum oxide (Al₂O₃), and amorphous silicon dioxide (SiO₂) in colloidal suspension.
