DiaSec Diamond Wafering Blade - General Purpose Metallography 4in

The DiaSec General Purpose Diamond Blade is a must-have for metallurgical sample preparation. Made with metal bonding, this 4in x 0.016in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni-alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert.

Diameter: 4in (100mm)
Thickness: 0.016in (0.4mm)
Arbor: 0.5in (12.7mm)

Item No DS-1004
1/pkg