Skip to content
diamond wafering blade 5-inch

DiaSec Diamond Wafering Blade - General Purpose Metallography 5in

by OnPoint Abrasives
$140.00 - $140.00
$140.00
$140.00 - $140.00
$140.00

The DiaSec General Purpose Diamond Blade is a great choice for metallurgical sample sectioning. Made with metal bonding, this 5in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni-alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert.

Diameter: 5in (125mm)
Thickness: 0.020in (0.5mm)
Arbor: 0.5in (12.7mm)

Item No DS-1005
1/pkg