DiaSec Diamond Wafering Blade - General Purpose Metallography 6in

The DiaSec General Purpose Diamond Blade is a must-have for metallurgical sample preparation. Made with metal bonding, this 6in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni-alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert.

Diameter: 6in (150mm)
Thickness: 0.024in (0.6mm)
Arbor: 0.5in (12.7mm)

Item No DS-1006
1/pkg