SilverBullet CMP Suspension – 0.05 µm, 32 oz

SilverBullet CMP Polishing Suspension is a unique blend of colloidal silica and polycrystalline alumina particles.  The colloidal silica provides a chemical contribution while the alumina enhances the mechanical properties for improved removal rates.  Coined SilverBullet for its wide range of material applications.

0.05 µm (50 nanometers)
pH 9.5 - 10

30% solids